Eugenijus Norkus

Abstract:

The possibility and conditions of using lower oxidation state metal ions as reducing agents for autocatalytic electroless metal deposition are discussed. The theoretical background of these types of reactions is presented from a thermodynamics perspective. Kinetic data on electroless silver, copper, palladium, and platinum deposition, using Co (II)/Co (III) redox systems with different ligands are presented and discussed. Ti (III)/Ti (IV) redox systems with different ligands were also shown to be suitable reducing agents for reducing Pt (IV), Pd (II), Ni (II) and Co (II) to a metallic state and forming a continuous metal layer on the surface to be plated. The morphology of metal layers deposited using above-mentioned reducing agents was characterized by means of Field Emission Scanning Electron Microscopy (FESEM). Kinetics of the metal deposition rate was investigated by means of the gravimetry or Electrochemical Quartz Crystal Microgravimetry (EQCM).